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Improved wettability of solder powder GTS LF 219C |
| Coating is applied to the solder powder, improving the wettability at the heat resistant preheating |
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Lead-free paste with a low fusing point LTLF 140 |
| Soldering is possible at reflow peak temperature for 190℃ or higher。 |
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βseries alloy use TAS LF 219β |
| Alloy LLS 219β us adopted, in which the generation of inter-metallic compounds from the copper in the land and solder alloy this is minimized. Increased wettability and decreased voiding means improved solder ability. |
| Products |
Specific gravity |
Ultimate tensile strength(MPa) |
Elongation(%) |
Hardness(Hv) |
Coefficient of linear expansion(x10^-6/k) |
| TAS LF 219β |
7.38 |
52.1 |
53 |
14.5 |
23.5 |
| Comparative product using LLS 219 |
7.38 |
48.7 |
47 |
13.8 |
20.8 |
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| ●Product line-up |
| Products |
Alloy |
Diameter(μm) |
Features |
Capacity/pcs |
| AC240 |
LLS219 |
25~38 |
No flux residue cracking (For N2 reflowing) |
1kg
.
500g
.
250g |
| TAS LF 219 |
LLS219 |
25~38 |
For commercial use (Suitable for various needs) |
| TAS STLF 219 |
LLS219 |
25~38 |
No flux residue cracking |
| TAS LF 219α |
LLS219α |
25~38 |
α series alloy use |
| TAS LF 219β |
LLS219β |
25~38 |
β series alloy use |
| TAS LF220 |
LLS220 |
25~38 |
For commercial use (Suitable for various needs) |
| TAS ST 150 |
LLS221 |
25~38 |
No flux residue cracking |
| GTS LF 219 |
LLS219 |
25~38 |
For standard commercial use (For solder ball) |
| GTS LF 219C |
LLS219 |
25~38 |
Heat resistant preheating, decreased void (Coating powder applied) |
| GTS LF 225 |
LLS225 |
25~38 |
For commercial use (Low Ag and low cost) |
| MS LF 219 |
LLS219 |
25~38 |
Solder paste (Washing) |
| LTLF 140 |
LLS140 |
25~38 |
Lead-free solder paste (With a low fusing point) |
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